Bond Patented Technology
Our Bond patent has been issued by the U.S. and European Patent Offices as U.S. Patent No. 10,987,301 B2 and EP 3 402 575 B1, respectively. Additional patent applications for our Bond System are pending in the U.S., Brazil, Canada, and Hong Kong.
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Read more about our Patent on Google Patents.
Our Patented Formula actively seeks out broken disulfide bonds to crosslink with.