Bond Patented Technology

 Our Bond patent has been issued by the U.S. and European Patent Offices as U.S. Patent No. 10,987,301 B2 and EP 3 402 575 B1, respectively. Additional patent applications for our Bond System are pending in the U.S., Brazil, Canada, and Hong Kong.

 

https://uberliss.com/blogs/news/163311751-a-look-into-the-science-behind-the-uberliss-bond-treatment 

 

Dr.Syed interview video?  

 

IG LINKS 

 

Patented Technology.

Read more about our Patent on Google Patents.

Our Patented Formula actively seeks out broken disulfide bonds to crosslink with.